Ming Chi University of Technology (MCUT) was honored to welcome Director Chen from C.SUN Inc. (志聖工業股份有限公司) on May 22, 2026, for a distinguished keynote lecture entitled “The Technological Development Roadmap of AI Chips and Advanced Semiconductor Packaging.”

　　Director Chen provided an in-depth introduction to the development trends of AI chip technologies and the evolution from traditional semiconductor packaging to advanced packaging. He also delivered a comprehensive analysis of advanced packaging technologies, covering some of the most representative cutting-edge technologies in the semiconductor industry today, including 2D advanced packaging, the three major Fan-Out packaging processes, 2.5D/3D IC chip stacking, CoWoS, and SoIC. In addition, he explained the design concepts, process characteristics, and application scenarios of these packaging technologies, enabling participants to gain a clearer understanding of their differences, advantages, and future development directions.

　　Drawing on numerous practical case studies and analyses of industry trends, Director Chen illustrated how advanced packaging technologies significantly enhance chip performance, memory bandwidth, data transmission speed, and overall system integration capabilities. He also highlighted their broad applications in artificial intelligence (AI), high-performance computing (HPC), automotive electronics, autonomous driving, data centers, 5G communications, smart devices, and the Internet of Things (IoT). Furthermore, he emphasized that the rapid growth in demand for high-end AI chips has made advanced packaging a key enabling technology for overcoming the limitations of Moore's Law and improving overall system performance, making it as critical as advanced semiconductor manufacturing processes.

　　In addition, Director Chen examined the major technical challenges associated with advanced packaging, including thermal management, power consumption optimization, heterogeneous integration, high-speed signal integrity, manufacturing yield, material reliability, and cost-effectiveness. He also analyzed the current development landscape and competitive dynamics of the global semiconductor supply chain in the field of advanced packaging. Looking ahead, he explained that the semiconductor industry is expected to continue advancing toward higher performance, lower power consumption, higher integration density, Chiplet-based architectures, heterogeneous integration, and System-in-Package (SiP) technologies to meet the rapidly growing demands of AI, big data, and cloud computing.

　　The lecture successfully combined solid theoretical knowledge with valuable industrial experience, providing participants with a comprehensive understanding of AI chips and advanced semiconductor packaging technologies. It also enhanced their appreciation of Taiwan's technological strengths, strategic position, and future opportunities within the global semiconductor supply chain. Moreover, the lecture reinforced the importance of advanced semiconductor packaging in strengthening national technological capabilities and industrial competitiveness. The insights gained are expected to serve as valuable references for future technology policymaking, industrial development, and cross-disciplinary innovation. Overall, the lecture was highly informative, insightful, and rewarding.

Fig 1: Ming Chi University of Technology Professor Wu (right) and CTO Chen (left) of C.SUN Inc. pose for a commemorative photo.

Fig 2: CTO Chen of C. SUN Inc. presents the company's development history and growth journey during the lecture.

Fig 3: Vice President for Research and Development Chen of Ming Chi University of Technology speaks about C. SUN Inc.'s long-term collaboration with and support for the university.

中文: 志聖工業股份有限公司陳明宗技術長演講「AI晶片與半導體先進封裝的技術發展路徑」