Ming Chi University of Technology(MCUT) participated for the first time in the Central European MSV International Engineering Fair, one of the most prestigious industrial expos held from October 8 to 11 at the Brno Exhibition Centre in the Czech Republic. MCUT was the only university from Taiwan participating in this event, joining the Taiwan Pavilion team organized by the Taiwan External Trade Development Council. The fair highlighted advanced industrial processes, including large machinery and automation equipment. MCUT showcased two cutting-edge technologies in the high-speed 5G era: ceramic substrates and microgrid technology, which address current global trends and foster international collaboration in academic and industry innovation.

The exhibit featured the Double Layer Low Temperature Co-fired Ceramic Patch Antenna developed by Professor Feng Kuei-Chih's team from the Department of Mechanical Engineering. In the era of artificial intelligence, high-speed network transmission has become essential. Through the laboratory’s proprietary materials and multi-layer ceramic co-firing technology, the team has developed an innovative antenna structure. The measured S11 signal characteristic of the antenna reaches -26dB, exceeding the industry requirement of -10dB, making it suitable for 5G commercial products and passive components. Additionally, Professor Luo Ching-Chuan from the Department of Electrical Engineering presented the Microgrid Integration Technology, which integrates solar and other renewable energy sources with distributed power and energy storage systems. Using smart monitoring installations and proprietary software, the technology meets the needs for autonomous energy control while reducing industrial electricity costs and achieving energy-saving and carbon reduction goals in an era of high electricity costs.

Professor Feng’s team’s invention was nominated for the Gold Medal in the fair’s invention competition, drawing interest from Tomáš Kubala, Chairman of Industry Cluster 4.0 in the Czech Republic, who explored the technology's applications and discussed potential future partnerships with local companies. Ambassador Ke Liang-Ruei of the Taipei Economic and Cultural Office in the Czech Republic and Wu Chun-Chien, Director of the Taiwan Trade Center in Warsaw, also visited the booth, engaging in discussions about the applications of both technologies and the results achieved through collaborations with various industries.

The Industry-University Cooperation Center and T5GIP actively participate in international exhibitions, showcasing the university’s advanced research technologies to connect with global companies, promote Taiwan's research capabilities, and support international partnerships and technology transfer, facilitating real-world applications and commercialization of new technologies.

Image 1: Ambassador Ke Liang-Ruei (second from the right) of the Taipei Economic and Cultural Office in the Czech Republic, along with Wu Chun-Chien (first from the left), Director of the Taiwan Trade Center in Warsaw, visited the MCUT booth. They engaged in in-depth discussions about the application scenarios of the two technologies and the current achievements through collaboration with industry partners. They also took a photo with Chu Ching-Mei (first from the right), Deputy Manager of the Industry-Academia Collaboration Center at MCUT.

中文：明志科大5G與微電網技術 亮相捷克布爾諾工業展
This article is simultaneously published in the 17th edition of the SDGs E-paper.